CVE-2022-22071

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Qualcomm — Multiple Chipsets

Added to KEV catalog: 5 December 2023
Federal remediation due date: 26 December 2023
Weakness classification (CWE): CWE-416

CISA Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.

Required action

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Notes

This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.4/-/commit/586840fde350d7b8563df9889c8ce397e2c20dda; https://nvd.nist.gov/vuln/detail/CVE-2022-22071

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