CVE-2024-43047

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Qualcomm — Multiple Chipsets

Added to KEV catalog: 8 October 2024
Federal remediation due date: 29 October 2024
Weakness classification (CWE): CWE-416

CISA Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.

Required action

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Notes

https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/dsp-kernel/-/commit/0e27b6c7d2bd8d0453e4465ac2ca49a8f8c440e2 ; https://nvd.nist.gov/vuln/detail/CVE-2024-43047

View on NVD View on MITRE CVE View full CISA catalog

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